China-based semiconductor technology developer Xi’an Eswin Silicon Wafer Technology raised RMB3bn ($464m) in series B funding on Friday from investors including insurer China Life’s Private Equity Investment unit.
Brokerage Citic Securities and its Goldstone Investment subsidiary co-led the round, which included Addor Capital, Beijing Singularity Power Investment Fund, China Internet Investment Fund, Shaanxi Private Fund, Triniti Capital and ZWC Partners.
Xi’an Eswin Silicon Wafer Technology was formed by chipmaker Beijing Eswin Technology Group in 2018 to produce integrated circuits on its behalf in the Chinese province of Shaanxi.
Yang Xinyuan, chief executive of Xi’an Eswin, said: “This funding will be used to expand production capabilities and meet further customer needs.” (Translated from Chinese by Global Corporate Venturing.)
The company had closed a series A round of undisclosed size from conglomerate Everbright Group’s Broad Vision Funds, IDG Capital and Triniti Capital in January 2021, according to data aggregator Tianyancha.
