Robert Bosch Venture Capital (RBVC), the corporate venturing arm of industrial product manufacturer Robert Bosch, co-led a $20m series B round for US-based interface technology developer UltraSense Systems yesterday.
Venture capital firm Artiman Ventures co-led the round, which included Sony Innovation Fund by IGV, a vehicle for consumer electronics firm Sony, as well as chemicals and materials producer Asahi Kasei, Hui Capital and Abies Ventures.
UltraSense is developing a sensor that will be able to be implanted into materials in order to facilitate touch-sensitive controls without a traditional touchscreen. The technology relies on ultrasound to remain functional even in thick materials like metal or wood.
The funding was raised as UltraSense prepares to launch its first devices later this year. It is working with a range of US and Asia-based partners including mobile device manufacturers.
Gen Tsuchikawa, chief investment manager at Sony Innovation Fund, said: “UltraSense is bringing to market a unique touch interface technology that not only provides practicality in implementation, but has the cool factor as it can sense through a variety of materials.
“From automotive to consumer products, we look forward to helping disrupt the touch interface market.”
The company said it has now raised $24m since being founded in 2018. It had previously secured $3.4m, according to a regulatory filing in November the same year.