AAA Resin.io compounds funding with $9m

Resin.io compounds funding with $9m

Resin.io, the US-based creator of a software development and management platform, raised $9m yesterday in a series B round that included communications technology provider Ericsson and industrial product maker General Electric.

Ericsson and GE, which invested through its GE Ventures unit, were joined in the round by venture capital firm DFJ and Aspect Ventures. It comes after a $3m series A round in April 2015 led by DFJ that included The OpenFund and angel investors Gil Dibner and Panos Papadopoulos.

Founded in 2013, Resin.io has built a software development platform for the internet of things (IoT) that incorporates devops tools and practices. It will put the money toward growing its product range and open source community, and forming new strategic partnerships.

Alexandros Marinos, Resin.io’s founder & CEO, said: “As billions of complex devices come online, IoT project leaders are faced with the dual challenges of safety and speed. They must securely maintain mission-critical remote devices, while also delivering new software features and functionality to their customers.

“Resin.io is a modern software deployment and management platform that builds on Docker, Git, Yocto and other open technologies to solve these challenges. With the support of GE Ventures and Ericsson we are exceptionally well positioned to help IoT project leaders use software as a strategic advantage.”

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