US-based connected device software development platform Resin.io has raised $5m in a round led by the IoT Fund Program operated by Soracom, the internet-of-things (IoT) subsidiary of telecommunications firm KDDI.
The round included industrial and power technology producer General Electric’s GE Ventures unit, venture capital firms DFJ and Aspect Ventures as well as unnamed existing investors.
Resin.io has built a software engineering platform that utilises cloud technology and programming containers to help developers create, implement and manage applications for IoT devices.
Soracom has formed a strategic pact with Resin.io that will involve the companies integrating their products and creating hardware that enables IoT devices to connect more easily.
GE Ventures joined communication technology supplier Ericsson, DFJ and Aspect Ventures in Resin.io’s $9m series B round in 2016, after DFJ, TheOpenFund, Gil Dibner and Panos Papadopoulos has supplied $3m in series A funding the previous year.