AAA Tela tucks into chip round

Tela tucks into chip round

Tela Innovations, a US-based chip design company, has raised $4.75m of a planned $5.5m round from 34 investors, according to a regulatory filing.

In two rounds in 2008, Tela raised more than $5.5m from corporate venturing units from Cadence Design Systems; KT Venture Group, the investment partner of KLA-Tencor; Qualcomm Ventures; Intel Capital; and venture capital firms AsiaTech Management, Sand Hill Finance Company and Teton Capital Company.

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