Canada-based semiconductor and microelectronic technology developer Reno Sub Systems has closed an $11.2m series C round led by Samsung Ventures, an investment subsidiary of consumer electronics manufacturer Samsung Electronics.
Intel Capital, the corporate venture capital arm of semiconductor maker Intel, also participated, along with electronics producer Hitachi High-Technologies, manufacturing technology provider MKS Instruments and semiconductor producers Lam Research and SK Hynix.
Reno develops radio frequency matching networks, power generators and gas delivery systems for use in nanoscale manufacturing. It will use the funding to support continued product development and ramp up manufacturing to meet demand.
The company raised $14m in May 2016 series B round led by a $9.3m investment from MKS Instruments and backed by Intel Capital.
Reno’s 2014 series A round was sized at $7.5m, according to local newspaper The Chronical Herald, and included Intel Capital, VC fund Innovacorp and undisclosed additional investors.
Bob MacKnight, chief executive of Reno Sub-Systems, said: “Our list of strategic investors now includes the venture arms of three of the top five largest semiconductor manufacturers, two out of four of the largest etch tool providers and a key subsystems supplier.
“The C round will allow us to support our rapidly growing number of deployments and enable high-volume manufacturing of our systems to support our recent platform wins.”