Dual Aperture International (DAI), a South Korea-based provider of integrated smart sensors, has raised $5.7m in its series A round from a consortium including system-on-chip technology provider EWBM.
Investment firm Value Investment Korea led the round, which also included Korea Advanced Institute of Science and Technology, the government-backed entity that co-formed DAI with US-based Dual Aperture using technology from its Center for Integrated Smart Sensors (CISS) department.
The funding was raised eight months after DAI signed a strategic partnership agreement with EWBM to develop a software and semiconductor product to support camera technology.
Cheol Lee, chief executive of Value Investment Korea, said: “We see Dual Aperture’s technology as a game changer and with the engineering resources and world class engineers of CISS, we see an opportunity for Dual Aperture International to disrupt the imaging business in mobile and beyond.”
A version of this article was first published by our sister title, Global Government Venturing.